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Conductive Ceramics

Conductive Ceramic Property

The formation, microstructure and electrical property of conductive ceramic composites derived from polymer pyrolysis were investigated. Methyl polysiloxane was mixed with TiH2 as a filler and pyrolyzed in nitrogen, argon and vacuum atmosphere at a temperature of 1600oC for 1 hour after the preheat treatment at 850oC in N2 atmosphere. Depending on the atmosphere conditions, TiN and Ti5Si3 phases were formed by reaction of TiH2 as reactive filler and atmospheric gas or pyrolytic product such as SiO2. Consequently, the microstructures of the ceramic composites with 70 vol.%TiH2 pyrolyzed at 1600oC for 1 hour in vacuum were composed of TiN and Ti5Si3 particles. The density and electrical conductivity of the ceramic composites were 97.3 TD% and, respectively. These composites pyrolyzed by polymer were considered as superior conductive material with a value of 103 ~ 104 in log scale at room temperature.


Several possibilities have been identified for practical applications of these materials. Because the developed composites are conducting, refractory and have high wear and impact resistance, they can be applied as anodes, heating elements, sensors, and circuit breakers as well as in related applications in which good mechanical properties under high current or temperature conditions are required. They can also be used for joining of SiC industrial components by direct, electric heating, in which the composite serves as the heating element and adhesive donor at the same time.

Apart from the applications mentioned above, the composites have been evaluated for cathodic and anodic behaviour. Polarisation measurements show that interfacial oxides form at the surfaces. Passivation occurs when they are treated as anodes. But after coating with a thin layer of Pt, the anodic behaviour of the composites approaches that of pure, solid Pt anode. These materials therefore can be used as a base for anodes to be used in oxygen evolution or fluoride contaminated applications such as copper fluoroborate plating.

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